Antimicrobial hexagonal boron nitride nanoplatelet composites for the thermal management of medical electronic devices
作者：Si-Wei Xiong, Pan Zhang, Yu Xia, Pei-Gen Fu and Jing-Gang Gai*
關鍵字：Antimicrobial，hexagonal boron nitride， thermal management， medical electronic devices
論文來源：期刊
具體來源：Mater. Chem. Front. 2019, 3(11), 2455-2462
發表時間：2019年
Hospitals need
adequately clean environments to avoid the growth of bacteria; however, most
thermally conductive materials used as a housing for medical electronic devices
provide an ideal substrate for bacterial growth. Herein, we grafted quaternary ammonium
compounds (QACs) on the surfaces of h-BN nanoplatelets via hydroxylation to
form functional fillers for linear low-density polyethylene (LLDPE); as expected,
the results of the antimicrobial testing of the 25 vol% QACs@h-BN/LLDPE
nanoplatelet composites showed approximately 100% growth inhibition against
both E. coli and S. aureus bacteria. Also, the zone-of-inhibition test confirms
that the disinfection method of QACs@h-BN/LLDPE nanoplatelet composites is
contact killing without the release of biocides, which cause environmental pollution.
Notably, morphology analyses (SEM) revealed that the introduction of organic
chains onto h-BN also significantly improved the degree of interface
combination with LLDPE, which promoted more efficient heat transfer. The
thermal conductivity of the 25 vol% QACs@h-BN/LLDPE nanoplatelet composites
could reach 1.115 W m_1 K_1; this value distinctly exceeded
that of the unmodified h-BN/ LLDPE nanoplatelet composites (0.926 W m_1 K_1).
Moreover, the preparation strategy of this research is substrate independent;
therefore, the modified QACs@h-BN nanoplatelets can be applied to a broad range
of materials to prepare different types of thermally conductive and
antimicrobial composite materials