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SFPC課題組電磁屏蔽復(fù)合材料研究成果發(fā)表在Materials Today Physics上

Fengqi Qi#, Lei Wang#, Yali Zhang, Zhonglei Ma*, Hua Qiu and Junwei Gu*. Robust Ti3C2Tx MXene/starch derived carbon foam composites for superior EMI shielding and thermal insulation. Materials Today Physics, 2021, 21: 100512. 2020IF=9.298.1區(qū)材料科學(xué)Top期刊)

https://doi.org/10.1016/j.mtphys.2021.100512

Lightweight and robust electromagnetic interference (EMI) shielding materials are highly desirable in high-end precision electronic components and 5G communication system. Herein, the starch based porous carbon foam (PCF) is prepared by yeast fermentation, steam foaming and carbonization approach with flour as raw material. And the Ti3C2Tx MXene/PCF (MPCF) composites are then fabricated via vacuum assisted impregnation of Ti3C2Tx MXene followed by freeze drying. The obtained PCF carbonized at 1400°C presents excellent compression strength of 4.9 MPa and superior electrical conductivity (σ) of 21.8 S/cm, respectively. The corresponding MPCF composites with 8.5 wt% Ti3C2Tx MXene exhibit superior EMI shielding effectiveness (EMI SE) and specific shielding effectiveness (SSE, EMI SE/ρ) of 75 dB and 216.9 dB·cm3/g, respectively. Meanwhile, the MPCF composites possess excellent flame retardancy and outstanding heat insulation, and can be applied in the extreme environment. The resultant lightweight, robust and multifunctional MPCF composites with simple fabrication processes show broad application prospects for EMI shielding system in aerospace, military engineering, electrical and electronics fields.

在高端精密電子元器件和5G通信系統(tǒng)中,輕量化、高強(qiáng)度電磁干擾(EMI)屏蔽材料尤為重要。本研究以面粉為原材料,通過酵母發(fā)酵、蒸汽發(fā)泡和碳化工藝制得淀粉基多孔碳泡沫(PCF),并通過真空輔助浸漬和冷凍干燥引入Ti3C2Tx MXene制得MXene/多孔碳泡沫(MPCF)復(fù)合材料。PCF復(fù)合材料兼具輕質(zhì)高強(qiáng)和高導(dǎo)電特點(diǎn),1400°C下碳化得到的PCFρ、壓縮強(qiáng)度和電導(dǎo)率(σ)分別為0.32 g/cm34.9 MPa21.8 S/cm。當(dāng)Ti3C2Tx MXene用量為8.5 wt%時(shí),MPCF復(fù)合材料的電磁屏蔽效能(EMI SE)和比屏蔽效能(SSEEMI SE/密度(σ))分別達(dá)到75 dB216.9 dB·cm3/g;同時(shí)兼具出色的阻燃性能和良好的隔熱性能,可適用高溫灼燒的極端環(huán)境。這種制備簡(jiǎn)單的多功能超輕碳材料在航空航天、軍事工程和電子電器等領(lǐng)域的EMI屏蔽系統(tǒng)中展現(xiàn)出廣闊的應(yīng)用前景。