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Thermally conductive polymer composites have become a research hotspot and an important branch in the fields of thermal conduction such as 5G communication equipment, electronic packaging and energy transmission due to their light weight, easy processing and low manufacturing cost, etc. However, the thermal conductivity coefficients (λ) of reported thermally conductive polymer composites are far from expected, and one of the most important reasons is the inherent interfaces between phases in the polymer composites and the high interfacial thermal resistance (ITR). This review summarizes the research history and the latest progress of ITR in thermally conductive polymer composites from 4 aspects: mathematical models, computer simulations, measurement techniques and strategies to reduce ITR. Furthermore, the problems of researches on ITR in urgent need for solution as well as corresponding possible solutions are illuminated, hoping to provide some guiding suggestions for the rapid and efficient improvement on λ of thermally conductive polymer composites.聚合物基導(dǎo)熱復(fù)合材料由于具有輕質(zhì)、易成型加工、低制備成本等諸多優(yōu)點，已成為5G通訊設(shè)備、電子封裝和能量傳輸?shù)葘?dǎo)熱領(lǐng)域的研究熱點和重要分支。然而現(xiàn)有聚合物基導(dǎo)熱復(fù)合材料的導(dǎo)熱系數(shù)（λ）遠低于預(yù)期值，其中一個重要的原因在于聚合物基復(fù)合材料固有的相界面以及較高的界面熱障。本文從界面熱障的數(shù)學(xué)模型、計算機模擬、測量方法以及降低界面熱障的策略4個方面對聚合物基導(dǎo)熱復(fù)合材料界面熱障的研究歷史與最新進展進行總結(jié)，闡明了聚合物基導(dǎo)熱復(fù)合材料領(lǐng)域目前亟需解決的界面熱障問題以及可能的解決方法，希冀為聚合物基導(dǎo)熱復(fù)合材料λ的快速高效提升提供一些指導(dǎo)性的建議。