作者：Junwei Gu, Qiuyu Zhang,Jing Dang andChao Xie
關鍵字：epoxy resin;boron nitride;thermal conductivity
論文來源：期刊
具體來源：Polymers for Advanced Technologies
發表時間：2011年
Boron nitride (BN) micro particles modified by silane coupling agent, γ-aminopropyl triethoxy silane (KH550), are employed to prepare BN/epoxy resin (EP) thermal conductivity composites. The thermal conductivity coefficient of the composites with 60% mass fraction of modified BN is 1.052?W/mK, five times higher than that of native EP (0.202?W/mK). The mechanical properties of the composites are optimal with 10?wt% BN. The thermal decomposition temperature, dielectric constant, and dielectric loss increase with the addition of BN. For a given BN loading, the surface modification of BN by KH550 exhibits a positive effect on the thermal conductivity and mechanical properties of the BN/EP composites.
http://onlinelibrary.wiley.com/doi/10.1002/pat.2063/full