Effect of silicone resin modification on the performance of epoxy materials for LED encapsulation
作者：Ruiheng Wen, Jizhen Huo, Jie Lv, Zhuoyu Liu, Yingfeng Yu*
關(guān)鍵字：LED encapsulation, epoxy, silicone
論文來(lái)源：期刊
具體來(lái)源：J Mater Sci-Mater El 2017, 28 (19), 14522-14535
發(fā)表時(shí)間：2017年
Cycloaliphatic epoxy resin was modified by phenyl methyl silicone resin to investigate the influence of silicone content on the performance and reliability of epoxy packaged light-emitting diode (LED). The silicone modification of epoxy encapsulants was characterized by transform infrared (FT-IR) spectrophotometer. Differential scanning calorimetry (DSC), thermogravimetric analyses (TGA), dynamic mechanical analysis (DMA), thermomechanical analyzer (TMA) were introduced to measure the thermal and mechanical properties. Ultraviolet visible (UV-Vis) spectrophotometer was utilized to study heat and ultraviolet resistance. In reliability test, scanning acoustic microscope (C-SAM) and scanning electron microscope (SEM) were applied to observe interfacial delamination. Water sorption process was monitored using gravimetric measurement. FT-IR study shows a chemical bonding between hydroxyl group of silicone resin and epoxy resin. With the incorporation of silicone resin, favorable properties were obtained such as higher thermal decomposition temperature, lower equilibrium water sorption, and better heat and UV resistance. Among these systems, 10% silicone modified epoxy resin exhibits the best performance in reliability test.